Solutions

We invite you to join us in shaping the future of connectivity.

Solutions

We invite you to join us in shaping the future of connectivity.

We provide co-integrated photonic connectivity solutions for the semiconductor and electronics industries. Using graphene, a single layer of carbon atoms, as a translator between both worlds, we connect chips without altering existing fabrication processes. Our deep intellectual property portfolio leads to the smartest way to connect thousands of chips to large fabrics.​

Design Services

Our design environment allows us to create solutions tailored to the unique needs of our partners. This flexibility ensures that our technology seamlessly integrates into diverse applications, providing a bespoke approach to every collaboration. Custom designs are available now.

Intellectual Property Licensing 

Allowing our customer and partners to access our deep portfolio of intellectual property through comprehensive licensing engagements will promote the use of graphene in the industry. 

200 mm wafer pilot production

We offer 200 mm wafer pilot projects starting from the second half of 2024 to bring our innovation to the market swiftly. 

300 mm wafer fabrication

Currently, we are in the advances stages of developing a cutting-edge wafer fabrication process, catering to both 200 mm and 300 mm wafers. This represents a significant leap forward, enabling scalability and cost-effectiveness that were once considered unattainable.